ElectroLinxx - EMC products and electro-technical components

Thermal Interface Material

NSG00B- is an unique non-silicone based thermal interface material grade.
Thermal conductivity of 3.0W/mK.

The material is made of Polyolefin.
In addition to the excellent thermal conductivity, the base material of Polyolefin
provides much better compressibility, so that better heat dissipation can be
obtained than Acrylic based similar products.

  • No Siloxane issue.
  • Excellent thermal conductivity of 3.0W/mK.
  • flexible.
  • Provides appropriate electric insulation.
  • Good compressibility which leads to better heat dissipation. The material
    fills air gaps between heat sinks and heat emitting components on p.c.boards.
  • Excellent workability based on appropriate hardness and self-tackiness
  • Available in custom sizes and die-cut requirement
  • UL94-V0

1. Places where low molecular Siloxane to be avoided for the reason such as
insufficient electric contact , parts deterioration, faulty sensor and so on.

2. Computers

3. Fiber Optic assembly/products

4. HDD

5. LED light

Supply Size

Standard Supply Size:

(1) sheet : length x width : 210mm x 300mm (A4 size)

Custom Size

Custom Size

thermal pad

Please specify L and W .

Thickness "T" can be designated within the range of 0.5mm
to 5mm.

Part Number System

NSG00B|Part Number System


width (mm)

sheet thickness (unit: 0.1mm)

Grade Index (NSG00B for thermal conductivity

No. Part Description thickness (mm) Sheet Width (mm) Sheet Length (mm)
1 NSG00B-005210300 0.5 210 300
2 NSG00B-010210300 1.0 210 300
Technical Data
Specifications NSG00A NSG00B TEST METHOD
Thickness(mm) 0.5-30   ASTM D374
Color Gray Red  
Specific Gravity 2.1 2.5 ASTM D792
Hardness (shore00) 40 60 ASTM D2240
Dielectric Breakdown (KV AC) >10 ASTM D149
Volume Resistivity (Ω-cm) 10^11 ASTM D257
Operation temp.(°C) -30 to 125  
Flame rating UL94V-0    
Thermal Conductivity (W/m•K) 1.5 3 ASTM D5470