NSG00B- is an unique non-silicone based thermal interface material grade.
Thermal conductivity of 3.0W/mK.
The material is made of Polyolefin.
In addition to the excellent thermal conductivity, the base material of Polyolefin
provides much better compressibility, so that better heat dissipation can be
obtained than Acrylic based similar products.
- No Siloxane issue.
- Excellent thermal conductivity of 3.0W/mK.
- flexible.
- Provides appropriate electric insulation.
- Good compressibility which leads to better heat dissipation. The material
fills air gaps between heat sinks and heat emitting components on p.c.boards. - Excellent workability based on appropriate hardness and self-tackiness
- Available in custom sizes and die-cut requirement
- UL94-V0
1. Places where low molecular Siloxane to be avoided for the reason such as
insufficient electric contact , parts deterioration, faulty sensor and so on.
2. Computers
3. Fiber Optic assembly/products
4. HDD
5. LED light
Standard Supply Size:
(1) sheet : length x width : 210mm x 300mm (A4 size)
thermal pad
Please specify L and W .
Thickness "T" can be designated within the range of 0.5mm
to 5mm.
length(mm)
width (mm)
sheet thickness (unit: 0.1mm)
Grade Index (NSG00B for thermal conductivity
3.0W/mK)
| No. | Part Description | thickness (mm) | Sheet Width (mm) | Sheet Length (mm) |
|---|---|---|---|---|
| 1 | NSG00B-005210300 | 0.5 | 210 | 300 |
| 2 | NSG00B-010210300 | 1.0 | 210 | 300 |
| Specifications | NSG00A | NSG00B | TEST METHOD |
|---|---|---|---|
| Thickness(mm) | 0.5-30 | ASTM D374 | |
| Color | Gray | Red | |
| Specific Gravity | 2.1 | 2.5 | ASTM D792 |
| Hardness (shore00) | 40 | 60 | ASTM D2240 |
| Dielectric Breakdown (KV AC) | >10 | ASTM D149 | |
| Volume Resistivity (Ω-cm) | 10^11 | ASTM D257 | |
| Operation temp.(°C) | -30 to 125 | ||
| Flame rating | UL94V-0 | ||
| Thermal Conductivity (W/m•K) | 1.5 | 3 | ASTM D5470 |