ElectroLinxx - EMC products and electro-technical components

SMT Gasket
  • Excellent grouding characteristics from a wide area of ground
  • Excellent electrical conductivity
  • The stabilization of components due to mounting levelly
  • Excellent reliability(repeated compression,brine-atomizing test pass)
  • Precise reel packaging for the accurate work.
  • Superior thermostable characteristics
  • High adhesion after SMT mounting
  • EMI Shielding.
  • Impedance matching function of PCB or FPCB.
  • Excellent Thermal Transfer.
  • Excellent ESD(Electrostatic discharge).
  • Cushion and anti-shock after SMT mounting.
  • EMI noise attenuation its power loss property.

Custom Size

Conductive Film

Silcone Core (Contained conductive
materials for electrical property)

ITEM Test Method Properties
Material Description Base Material Silicone rubber/PI Film
Filler(Core) Carbon
Colo Visual Silver
Heat Resistance (°C) Internal Test Method 400°C
Service Temp. (°C) Internal Test Method -40 ~ + 280°C
Electric Resistance( Ω ) Origin HIOKI 3540 mΩ HITESTER Max. 0.1 Ω
Thermo-hygrostat Max. 0.1 Ω
Brine Atomizing Max. 0.1 Ω
Thermal Shock Max. 0.1 Ω
Adhesion Strength (gf) UTM Min. 1500gf
Compression-Deflection Rate (%) 20% Compression Min. 95%
85°C/85%RH, 200Hr
Hardness KS M 6519 (Shore A) 65 ± 8
Flammability UL 94 UL 94-V1
RoHS & Halogen Free Pb, Cd, Hg, Cr+6, PBBs, PBDEs, Br, Cl N.D.
How to order

ELX-SMT-W How-to-orde

Conductivity Material Type: None
(General Type), SA, SB, SC, SD,SE
(Special Type)

Type: H(with a hole), N(without a hole)

Length(mm) ▶︎100 means 1.0mm

Height(mm) ▶︎100 means 1.0mm

Width(mm) ▶︎100 means 1.0mm

W: Wrapping type

Serial Number

For Example:
P/N : ELX-SMT-W- 002 – 003 – 003 – N – SA
Serial Number:ELX-SMT
W:Wrapping type
Type : N(without a hole)
Conductivity Material Type:SA
Recommended Reflow Soldering Conduction:

Recommended Reflow Soldering Conduction:

Recommended Solder Land Pattern Design:

Recommended Solder Land Pattern Design